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• N. parte: M368L3324BTM-LCC

  Produttore:
  SAMSUNG[Samsung semiconductor]

  Temperatura:
  

  Descrizione:
  SDRAM Unbuffered Module 184pin Unbuffered Module based 512Mb B-die with 64/72-bit ECC/ECC TSOP-II

  PDF Dimensioni: Kb PDF Pagine: Page

  Comprare M368L3324BTM-LCC

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M368L3324BTM-LCC PDF

Parte n. connessi

• M368L3324BT SAMSUNG[Samsung semiconductor]
  SDRAM Unbuffered Module 184pin Unbuffered Module based 512Mb B-die with 64/72-bit ECC/ECC TSOP-II
• M368L3324BTM-CB3 SAMSUNG[Samsung semiconductor]
  SDRAM Unbuffered Module 184pin Unbuffered Module based 512Mb B-die with 64/72-bit ECC/ECC TSOP-II
• M368L3324BTM-CCC SAMSUNG[Samsung semiconductor]
  SDRAM Unbuffered Module 184pin Unbuffered Module based 512Mb B-die with 64/72-bit ECC/ECC TSOP-II
• M368L3324BTM-LB3 SAMSUNG[Samsung semiconductor]
  SDRAM Unbuffered Module 184pin Unbuffered Module based 512Mb B-die with 64/72-bit ECC/ECC TSOP-II
• M368L3324BTM-LCC SAMSUNG[Samsung semiconductor]
  SDRAM Unbuffered Module 184pin Unbuffered Module based 512Mb B-die with 64/72-bit ECC/ECC TSOP-II

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